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MCM - Multi Chip Module / HDI - High Density Interconnect
Dual Flatpack Package
Fiber Optic / Laser Diodes
Leaded Chip Carriers
Land Grid Array/ Ball Grid Array
Leadless Chip Carriers
Multi Chip Module/ High Density Interconnect
Plug-in
Power Hybrid
Quad Flatpack
Small Outline Integrated Circuit
Special / Custom Work
Stack Flatpack
Lead Count
Per Side
Lead c/c
Spacing
Package Size
Catalog Data Sheet Azimuth Part No.
6
3
.047
.324 x .386
6
3
.047
.324 x .386
40
10
.040
.625 sq. max

8000-040-40 Carrier
8500-040-40 Contactor
44
11
1.00 mm
.625 sq. max
44
11
0.050
.770 sq. max
52
13
0.040
.625 sq. max
52
13
0.050
.955 sq.
68
17
0.050
1.510 sq. max
68
17
0.050
1.690 sq. max
72
36
0.025
1.345 x 2.105 max
80
20
0.050
1.510 sq. max
82
20 x 21
0.050
1.510 sq. max
84
21
0.040
1.050 sq. max
84
21
0.050
1.510 sq. max
96
24
0.050
1.510 sq. max
100
25
0.020
.570 sq. max
100
50
0.025
1.715 x 1.105 max
100
25
0.050
1.510 sq. max
132
33
0.040
1.810 sq. max
132
33
0.025
1.100 sq. max
132
33
0.025
1.056 sq. max
164
41
0.025
1.510 sq. max
172
43
0.025
1.510 sq. max
172
43
0.025
1.510 sq. max
180
36 x 54
0.030
1.140 x 1.680 max
196
49
0.025
1.510 sq. max
200
50
.80 mm
44 mm sq.
224
56
0.025
1.690 sq. max
256
64
0.020
1.620 sq. max
260
65
.80 mm
56 mm sq.
274
50 x 87
0.025
1.630 x 2.560 max
280
70
.80 mm
60 mm sq.
296
74
.65 mm
52 mm sq.
300
75
.80 mm
64 mm sq.
304
76
.020
1.810 sq. max
304
76
.50 mm
45.90 mm sq.
320
80
.65 mm
56 mm sq.
344
86
.65 mm
60 mm sq.
368
59 x125
0.030
2.250 x 4.250 max
368
92
.65 mm
64 mm sq.
392
98
.65 mm
68 mm sq.
408
102
0.025
2.954 sq. max
442
71 x 150
0.025
2.250 x 4.250 max
N
A X B
0.025
N
A X B
0.025
N
A X B
0.030
N
A X B
0.030
N
A X B
0.040
N
A X B
0.040
N
A X B
0.040
N
A X B
0.040
N
A X B
0.050
N
A X B
0.050
N
A X B
0.090
N
A X B
0.090
N
N
N
N
N
N
N
N