Product Line

Custom Burn-In & Test Sockets

Precision-engineered socketing solutions for every IC package type. Over 60 years of expertise in designing and manufacturing custom test and burn-in sockets for semiconductor testing.

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Flat Package Sockets — SIP, SOP, SOIC configurations

Flat Package Sockets

Custom burn-in and test beds for flat package ICs including SIP, SOP, SOIC, and SSOP configurations. Designed for reliable contact performance across thousands of insertion cycles.

Applications

  • DIP packages
  • SOP / SMD
  • SSOP / TSSOP
  • Custom flat config options

Benefits

  • Long cycle life
  • Low contact resistance
  • Custom pin configurations
  • Burn-in temperature rated
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Quad Flat Package Sockets — QFP precision test sockets

Quad Flat Package Sockets

Precision QFP test sockets engineered for quad flat package ICs. Available in open-top and clamshell designs with fine pitch contact technology.

Applications

  • QFP packages
  • LQFP / TQFP
  • Fine pitch configurations
  • High pin count devices

Benefits

  • Fine pitch capability
  • High-signaling contacts
  • Open-top access
  • Temperatures above 150°C
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Leadless Chip Carrier Sockets — ceramic and plastic LCC packages

Leadless Chip Carrier Sockets

Custom LCC sockets for ceramic and plastic leadless chip carrier packages. Engineered for military, aerospace, and high-reliability applications.

Applications

  • CLCC packages
  • PLCC packages
  • Military grade ICs
  • Ceramic packages

Benefits

  • Mil-spec compatible
  • Low contact resistance
  • High temperature rated
  • Low insertion force
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Grid Array Sockets — BGA, PGA, and LGA test sockets

Grid Array Sockets

BGA, PGA, and LGA test sockets with precision contact alignment. Custom solutions for high-density grid array packages used in advanced semiconductor testing.

Applications

  • BGA / uBGA
  • PGA packages
  • LGA packages
  • CSP packages

Benefits

  • High density pin count
  • Precision alignment
  • Kelvin contact options
  • Signal integrity optimized
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Plug-In Sockets — through-hole DIP and PGA burn-in sockets

Plug-In Sockets

Through-hole plug-in sockets for DIP and PGA packages. Designed for burn-in boards and test fixtures requiring reliable, repeated insertion cycles.

Applications

  • DIP packages
  • PGA through-hole
  • Burn-in test boards
  • Test fixture mounting

Benefits

  • Easy board mounting
  • High insertion cycles
  • Address contact options
  • Standard and custom strikes
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Specialized Custom Sockets — fully custom socketing solutions

Specialized Custom Sockets

Fully custom socket solutions for unique package types, non-standard configurations, and specialized testing requirements. Our engineering team designs from scratch.

Applications

  • Non-standard packages
  • Burn-chip modules
  • Configurable devices
  • RF / mmWave components

Benefits

  • Complete custom design
  • Engineered to precision
  • Prototype to production
  • Any package type
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Ready to Start Your Custom Socket Project?

Our engineering team is ready to design your next burn-in or test socket. Let's build something precise together.